ABLESTIK ECF564A-1
Harmonization Code : 3403.19 | Lubricating Preparations (With 70% or More Petroleum Oils) For Automotive and Other Uses
Main features
- MIL-STD-883C Method 5011 Compliance
- Low-Outgassing Hybrid Package Bonding
- Electrically Conductive Film Interconnect
Product Description
LOCTITE ABLESTIK ECF 564A is a configurable silver-filled epoxy film with a glass-fabric carrier for electrically conductive hybrid-package assembly. It is supplied as sheet stock or die-cut preforms, with thickness and dimensions selected for the supplied configuration. It has a 3-day work life at 25 deg C and a recommended cure of 2 hours at 150 deg C. The cured film has a typical volume resistivity of 0.0004 ohm cm and joint resistance of 0.002 ohm per 0.5 in^2 through gold joints. The product meets MIL-STD-883C, Method 5011, and is available only with 5011 certification.
Key features
- Glass-reinforced conductive film: A silver-filled epoxy coating on glass fabric provides a preformed conductive bonding layer for package assembly.
- Low-outgassing package assembly: NASA outgassing values and controlled ionic data support hybrid packages that require low contamination.
- Method 5011 compliance: The product meets MIL-STD-883C, Method 5011, and is supplied only with 5011 certification.
Applications
Applications include hybrid-package assembly and electrically conductive film bonding in supported package constructions.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Supplied thickness and dimensions depend on the selected sheet or die-cut configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Silver film | As supplied | |
| Construction | Silver-filled epoxy on glass fabric | As supplied | |
| Work life | 3 | days | 25 deg C |
| Shelf life | 365 | days | -40 deg C; from date of manufacture |
| Available forms | Sheet stock or die-cut preforms | Dimensions are configuration-specific | |
| Cure schedule | 2 | hours | 150 deg C; guideline recommendation |
After-processing / final-state properties
Final-state values are typical for cured ECF 564A material and the stated joint configurations.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Coefficient of thermal expansion, below Tg | 30 | ppm/deg C | TMA |
| Glass transition temperature | 150 | deg C | TMA |
| Thermal conductivity | 2.2 | BTU ft^-1 h^-1 deg F^-1 | 121 deg C |
| Volume resistivity | 0.0004 | ohm cm | Typical cured film |
| Joint resistance | 0.002 | ohm per 0.5 in^2 | Measured through gold joints |
| Lap shear strength | 2,200 | psi | Aluminum-to-aluminum; 25 deg C |
| Lap shear strength | 1,800 | psi | Gold-to-gold; 25 deg C |
| NASA outgassing | TML 0.3; CVCM <0.01; WVR 0.18 | % | Typical cured material |
