ABLESTIK FS163
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Equal-Weight BIPAX Mixing
- Room-Temperature or Heat Cure
- Broad-Material Industrial Bonding
Product Description
LOCTITE ABLESTIK FS 163 BIPAX is a two-component, non-conductive polyamide/epoxy adhesive for industrial bonding and sealing. Resin and hardener mix at 100:100 by weight, with a typical mixed viscosity of 30,000 mPa s and a 75-minute pot life at 25 deg C. The adhesive cures for 24 hours at 25 deg C or 4 hours at 65 deg C. Its stated operating-temperature range is -60 to 100 deg C. The cured material has a typical Shore D hardness of 77, Izod impact strength of 1.14 ft-lb/in of notch, and dielectric strength of 18 kV/mm.
Key features
- Equal-weight BIPAX mixing: A 100:100 resin-to-hardener ratio by weight simplifies component proportioning before application.
- Room-temperature or heat cure: Cures in 24 hours at 25 deg C or 4 hours at 65 deg C for process flexibility.
- Broad material bonding: Bonds and seals supported metals, rigid plastics, glass, ceramics, rubber, wood, concrete, and other listed materials.
Applications
Applications include industrial bonding and sealing of metals, rigid plastics, glass, ceramics, leather, rubber, wood, and concrete.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Values apply to the mixed two-component adhesive unless another state is shown.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Amber | Mixed adhesive | |
| Mix ratio, resin:hardener | 100:100 | by weight | Specified component ratio |
| Mixed viscosity | 30,000 | mPa s | 25 deg C |
| Thixotropic index | 1.0 | Mixed material | |
| Specific gravity | 1.12 | Mixed material | |
| Pot life | 75 | minutes | 25 deg C |
| Cure schedule | 24 at 25 or 4 at 65 | hours at deg C | Guideline room-temperature or heat cure |
| Optimal storage | <=27 | deg C | Unopened container |
After-processing / final-state properties
Values are typical for the cured non-conductive adhesive under the stated conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature | -60 to 100 | deg C | Product operating range |
| Shore D hardness | 77 | Typical cured material | |
| Coefficient of linear thermal expansion | 64 | ppm/deg C | Typical cured material |
| Izod impact strength | 1.14 | ft-lb/in of notch | Typical cured material |
| Dielectric strength | 18 | kV/mm | Typical cured material |
| Dielectric constant | 3.35 | 1 kHz; 25 deg C | |
| Dissipation factor | 0.01 | 1 kHz; 25 deg C | |
| Volume resistivity | 1.00 x 10^14 | ohm cm | 25 deg C |
