CYBERBOND 2075
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- High-Viscosity Gap-Filling Bonding
- Controlled Joint Placement
- Single-Component Fast Assembly
Product Description
Cyberbond 2075 uses a medium- to high-viscosity ethyl cyanoacrylate format for general-purpose bonding where gap filling and controlled placement are needed. Its thicker consistency helps keep adhesive at the joint rather than relying on wicking flow, supporting less closely fitted parts and localized application. The product cures without premixing and supports fast assembly of compatible substrates. Cyberbond 2075 provides a higher-body instant adhesive option for small gaps and bond areas where added material body is useful.
Key features
- Higher-viscosity gap filling: The adhesive is used where small gaps require more body than a wicking cyanoacrylate.
- Controlled joint placement: The thicker liquid profile supports localized application at the bond area.
- Single-component fast bonding: The one-part adhesive supports rapid assembly without a mix step.
Applications / Suitable for
- General-purpose bonding with small gaps
- Less closely fitted component joints
- Localized adhesive placement and rapid assembly
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
As-supplied and application characteristics for the one-component adhesive. Values are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology / base | Ethyl cyanoacrylate | One-component adhesive | |
| Physical form | Medium- to high-viscosity liquid | As supplied | |
| Cure mechanism | Humidity initiated | Cyanoacrylate cure | |
| Application behavior | Controlled localized placement | Reduced wicking compared with low-viscosity grades | |
| Gap behavior | Small-gap filling | Close-fitting bonded assemblies |
