DOWSIL Q3-6679

FLUOROGEL Q3-6679 Dielectric Gel is a two-part clear fluorosilicone dielectric gel for protecting and insulating electronic assemblies exposed to fuels or solvents. The equal-part system uses a 1:1 mix ratio and offers a long working time for dispensing and assembly. It can cure at room temperature or with heat, allowing the cure approach to match the production schedule. The cured gel provides soft dielectric encapsulation while the fluorosilicone chemistry addresses applications that require solvent-resistant protection. Suitable uses include protective gel coverage in PCB system assemblies and dielectric insulation where fuel or solvent exposure is part of the operating environment.

Key features

• Fuel and solvent resistance: Fluorosilicone gel construction is intended for dielectric protection where fuel or solvent exposure is required.
• Equal-part mixing: A 1:1 mix ratio supports straightforward preparation of the two-part system.
• Flexible cure options: Room-temperature or heat cure supports different assembly and production schedules.

Applications / Suitable for

• Dielectric gel protection where fuel or solvent resistance is required
• Protective gel coverage in PCB system assemblies