DOWSIL TC-6020
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- Flowable Power-Electronics Encapsulation
- Moderate-Temperature Fast Cure
- 2.7 W/(m K) Thermal Protection
Product Description
DOWSIL TC-6020 Thermally Conductive Encapsulant is a two-part gray silicone encapsulant for combining heat dissipation, electrical protection, and stress relief in power electronics. The 1:1 system has a typical mixed viscosity of 10,640 mPa s and a 77-minute pot life at 25 deg C, supporting manual or automated dispensing into complex assemblies. Moderate heat accelerates cure to about 23 minutes at 60 deg C or 5 minutes at 100 deg C. The cured encapsulant provides 2.7 W/(m K) bulk thermal conductivity, Shore A 63 hardness, and typical aluminum-to-aluminum lap shear strength of 0.3 MPa. Applications include on-board chargers, automotive control units, and power converters.
Key features
- Flowable electronic encapsulation: A typical mixed viscosity of 10,640 mPa s supports manual or automated dispensing.
- Moderate-temperature heat cure: Typical cure schedules include 23 minutes at 60 deg C and 5 minutes at 100 deg C.
- Thermal protection performance: Cured bulk thermal conductivity is 2.7 W/(m K).
Applications / Suitable for
- On-board chargers
- Automotive control units
- Power inverters and converters
Technical Specifications
General Properties
Mechanical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical mixed-system properties and processing windows before cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Number of parts | 2 | Part A and Part B | |
| Mix ratio | 1:1 | By weight | |
| Component colors | White; gray | Part A; Part B | |
| Mixed color | Gray | After mixing | |
| Mixed viscosity | 10,640 | mPa s | Typical |
| Pot life | 77 | min | At 25 deg C |
| Heat-cure schedule | 23 | min | At 60 deg C |
| Heat-cure schedule | 5 | min | At 100 deg C |
After-processing / final-state properties
Typical properties of the cured encapsulant; thermal conductivity is a bulk-material value.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Density | 2.93 | g/cm^3 | Cured material |
| Durometer hardness | 63 | Shore A | Cured material |
| Thermal conductivity | 2.7 | W/(m K) | Cured bulk material |
| Tensile strength | 0.95 | MPa | Cured material |
| Elongation | 20.6 | % | Cured material |
| Lap shear strength | 0.3 | MPa | Aluminum-to-aluminum |
