DYMAX 9-7001
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Thixotropic Pink Dispense Control
- Wave-Solder and Reflow Protection
- One-Piece Residue-Free Removal
Product Description
Dymax SpeedMask 9-7001 PCB Protective Maskant is a single-component pink peelable maskant for temporary PCB protection during solvent-based conformal coating, wave soldering, and reflow. Its thixotropic acrylated urethane gel supports controlled manual or automated dispensing and remains visible against common board surfaces. UV or visible light converts the applied material into a removable process barrier. The cured mask tolerates the intended assembly exposure, then peels away in one piece without residue when used within the prescribed process, including protection around gold- and copper-plated pins.
Key features
- Pink Thixotropic Placement: High visual contrast and controlled flow support accurate dispensing.
- Multi-Process PCB Protection: The cured barrier protects selected areas during conformal coating, wave soldering, and reflow.
- One-Piece Clean Removal: The mask peels away after processing without residue under the stated process.
Applications / Suitable for
- PCB masking during solvent-based conformal coating
- PCB masking during wave soldering
- PCB masking during reflow
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Chemical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
As-supplied characteristics used for material and process evaluation. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Chemical class | Acrylated urethane | - | As supplied |
| Component count | One-part | - | As supplied |
| Uncured appearance | Pink translucent gel | - | As supplied |
| Rheology | Thixotropic | - | Manual or automated dispensing |
| Halogen content | Halogen-free | - | As supplied |
| Silicone content | Silicone-free | - | As supplied |
| Cure mechanism | UV/visible light | - | After application |
After-processing / final-state properties
Final-state characteristics after the stated cure or processing condition. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Final form | Peelable protective mask | - | After light cure |
| Removal behavior | Peels in one piece | - | After PCB processing |
| Residue after removal | None | - | Properly cured and removed |
| Thermal process exposure | Wave solder and reflow | - | Cured mask |
| Coating compatibility | Solvent-based conformal coating barrier | - | Cured mask |
| Protected finishes | Gold- and copper-plated pins | - | Temporary masking |
