DYMAX 9008
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Thixotropic Flex-Circuit Dispensing
- Low-Modulus Cured Flexibility
- Dielectric Multi-Substrate Protection
Product Description
Dymax 9008 UV-Curable Flexible Circuit Adhesive & Encapsulant is a thixotropic light-curable material for localized chip encapsulation and bonding on flexible circuits. Its controlled-flow form supports placement around components, while the cured material combines low-modulus flexibility with dielectric protection. The product is stated for chip-on-board and chip-on-flex assemblies and for bonding polyimide or Kapton, DAP, glass, epoxy board, metal, and PET substrates. Selection and cure settings should remain matched to the actual substrate, light access, bondline geometry, and operating-temperature requirements.
Key features
- Thixotropic localized dispensing: Controlled flow supports targeted placement around chips and flexible-circuit features.
- Low-modulus flexibility: The cured material is positioned to remain flexible in flex-circuit encapsulation and bonding.
- Multi-substrate electronics bonding: Documented substrate scope includes polyimide, DAP, glass, epoxy board, metal, and PET.
Applications / Suitable for
- Chip encapsulation on flexible circuits
- Chip-on-board and chip-on-flex assemblies
- Bonding polyimide, DAP, glass, epoxy board, metal, and PET
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Chemical Properties
Thermal Properties
Other Properties
Additional Information
As-supplied / before-processing properties
Application characteristics before UV cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Physical form | Thixotropic adhesive and encapsulant | As supplied | |
| Cure activation | UV light | Applied material | |
| Application behavior | Controlled localized placement | Before cure | |
| Substrate scope | Polyimide or Kapton; DAP; glass; epoxy board; metal; PET | Recommendations | |
| Assembly role | Chip encapsulation on flexible circuits | Before final cure |
After-processing / final-state properties
Cured-state characteristics within the stated substrate and temperature scope.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cured mechanical character | Low modulus and flexible | After UV cure | |
| Electrical role | Dielectric protection | Cured encapsulant | |
| Temperature behavior | Flexible within the stated temperature context | Final-state use | |
| Assembly scope | Chip-on-board; chip-on-flex | Applications | |
| Final compatibility boundary | Substrate- and process-specific | Evaluate the actual assembly configuration |
