DYMAX 9014
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- UV Cure with Moisture Backup
- Controlled Gel Encapsulation
- Dual-Cure Mechanical Protection
Product Description
Dymax Dual-Cure 9014 UV/Moisture-Curing Encapsulant is a room-temperature-stable yellow translucent gel for protecting wire bonds and chip assemblies. UV light provides the primary cure in exposed areas, while ambient moisture completes cure in shadowed regions that light cannot reach. Its gel rheology supports controlled placement and application-thickness management before cure. The cured encapsulant is stated with hardness, tensile strength, elongation, and modulus data after the combined cure process. Applications include chip-on-board, chip-on-flex, chip-on-glass, and wire-bond encapsulation.
Key features
- UV cure with moisture backup: Light provides primary cure while ambient moisture addresses shadowed areas.
- Gel placement control: The yellow translucent gel supports localized dispensing and controlled application thickness.
- Balanced cured mechanical profile: Final-state documentation covers hardness, tensile strength, elongation, and modulus after dual cure.
Applications / Suitable for
- Chip-on-board encapsulation
- Chip-on-flex and chip-on-glass encapsulation
- Wire-bond encapsulation
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Chemical Properties
Thermal Properties
Other Properties
Additional Information
As-supplied / before-processing properties
Application and cure-system characteristics before full dual-cure completion.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Yellow translucent | As supplied | |
| Physical form | Gel encapsulant | As supplied | |
| Primary cure | UV light | Light-accessible areas | |
| Secondary cure | Ambient moisture | Shadowed areas | |
| Storage behavior | Room-temperature stable | Before use | |
| Application control | Maximum recommended thickness applies | Per stated dispense and cure conditions |
After-processing / final-state properties
Final-state characteristics after the combined UV and moisture cure process.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure state | UV plus moisture cured | Combined cure process | |
| Shadowed-area completion | Moisture secondary cure | Areas not reached by UV light | |
| Mechanical data scope | Hardness; tensile strength; elongation; modulus | After dual-cure completion | |
| Encapsulation role | Protective chip and wire-bond coverage | Final installed state | |
| Final application boundary | Assembly- and cure-specific | Evaluate the actual geometry and cure access |
