DYMAX 9037-F
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Dual Light and Heat Cure
- Thixotropic Glob-Top Control
- Blue-Fluorescent Coverage Inspection
Product Description
Dymax Multi-Cure 9037-F Blue Fluorescing Encapsulant/Wire Bond Adhesive is a single-component acrylated urethane encapsulant and wire-bond adhesive for chip-on-board, chip-on-flex, chip-on-glass, and wire-bond assemblies. UV or visible light provides the primary cure, while a secondary heat-cure route addresses material in shadowed areas. Its thixotropic, high-viscosity form supports controlled glob-top placement, and blue fluorescence improves visual confirmation of coverage. The cured material is clear and flexible, with moisture and thermal resistance for protected electronic components and interconnects.
Key features
- Shadow-Area Cure Coverage: Secondary heat cure complements UV or visible light where direct exposure is limited.
- Controlled Glob-Top Placement: Thixotropic, high-viscosity rheology retains material over chips and wire bonds.
- Blue-Fluorescent Inspection: Fluorescence under black light supports coverage checks after dispensing.
Applications / Suitable for
- Chip-on-board encapsulation
- Chip-on-flex encapsulation
- Chip-on-glass encapsulation
- Wire bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Chemical Properties
Thermal Properties
Other Properties
Additional Information
As-supplied / before-processing properties
As-supplied characteristics used for material and process evaluation. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Chemical class | Acrylated urethane | - | As supplied |
| Component count | One-part | - | As supplied |
| Appearance | Translucent gel | - | As supplied |
| Rheology | Thixotropic, high viscosity | - | As supplied |
| Viscosity | 55,000 nominal | cP | Typical; as supplied |
| Solvent content | No solvents added | - | As supplied |
| Cure routes | UV/visible light and secondary heat | - | Secondary heat for shadowed areas |
After-processing / final-state properties
Final-state characteristics after the stated cure or processing condition. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cured appearance | Clear | - | After cure |
| Inspection response | Blue fluorescence | - | Under black light |
| Flexibility | Flexible | - | Cured material |
| Moisture resistance | Resistant | - | Cured material; qualitative |
| Thermal resistance | Resistant | - | Cured material; qualitative |
