DYMAX 9309-SC
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Blue-to-Clear Cure Confirmation
- Thixotropic Needle or Jet Dispensing
- Localized BGA/CSP Ruggedization
Product Description
Dymax 9309-SC See-Cure Light-Cure BGA/CSP Reinforcement Adhesive is a single-component light-curable adhesive for reinforcing BGA, CSP, fine-pitch, and leadless components on printed circuit boards. Its highly thixotropic blue gel remains positioned during needle or jet dispensing, then changes from blue to clear as cure progresses. UV or visible light produces a tack-free cured surface for localized edge bonding and component ruggedization. The material supports shock attenuation and can replace full-area underfill in selected reinforcement designs that call for targeted coverage.
Key features
- See-Cure Color Confirmation: A blue-to-clear response helps identify sufficient light exposure.
- Thixotropic Dispense Control: The high-viscosity gel shows minimal movement after needle or jet dispensing.
- Localized Component Ruggedization: Edge reinforcement supports shock attenuation around BGA, CSP, and leadless packages.
Applications / Suitable for
- BGA and CSP reinforcement
- Fine-pitch and leadless component reinforcement
- Localized shock attenuation
- Targeted underfill-alternative reinforcement
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Chemical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
As-supplied characteristics used for material and process evaluation. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Chemical class | Acrylated urethane | - | As supplied |
| Component count | One-part | - | As supplied |
| Uncured appearance | Blue transparent gel | - | As supplied |
| Viscosity | 45,000 nominal | cP | Typical; as supplied |
| Rheology | Highly thixotropic | - | Minimal movement after dispense |
| Solvent content | No solvents added | - | As supplied |
| Dispense methods | Needle or jet | - | Localized application |
After-processing / final-state properties
Final-state characteristics after the stated cure or processing condition. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure-indicator change | Blue to clear | - | After sufficient UV/visible-light cure |
| Cured appearance | Clear | - | After cure |
| Surface condition | Tack-free | - | After light cure |
| Reinforcement behavior | Shock attenuation and ruggedization | - | Localized edge reinforcement |
