DYMAX 9422-SC
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- See-Cure Visual Progress Check
- High-Thixotropy Placement Control
- Localized Shock-Absorbing Reinforcement
Product Description
Dymax 9422-SC See-Cure Light-Cure Reinforcement Adhesive is a one-part, highly thixotropic adhesive for PCB component reinforcement and bonding. UV or visible light initiates cure after placement, and the See-Cure response changes the material from blue to clear as cure develops. The non-flowing gel supports precise placement around fine-pitch and leadless components, where it adds localized reinforcement and absorbs mechanical shock. This combination gives assemblers a visible cure cue, stable dispense placement, and focused support around selected components.
Key features
- See-Cure Visual Response: The blue-to-clear change gives a visible indication of cure progress.
- High-Thixotropy Placement: The gel resists movement after localized dispensing around components.
- Reinforcement and Bonding: The cured adhesive supports component reinforcement, shock absorption, and bonding.
Applications / Suitable for
- Fine-pitch component reinforcement
- Leadless component reinforcement
- Localized shock absorption
- PCB component bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Chemical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
As-supplied characteristics used for material and process evaluation. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component count | One-part | - | As supplied |
| Uncured appearance | Blue gel | - | As supplied |
| Rheology | Highly thixotropic | - | Localized dispensing |
| Cure mechanism | UV/visible light | - | After placement |
| Cure indicator | See-Cure blue-to-clear response | - | During cure |
| Application behavior | Controlled localized placement | - | Around PCB components |
After-processing / final-state properties
Final-state characteristics after the stated cure or processing condition. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cured appearance | Clear | - | After sufficient light cure |
| Cure indication | Blue-to-clear transition | - | During cure |
| Reinforcement behavior | Localized component support | - | Cured adhesive around PCB components |
| Impact response | Shock absorption | - | Reinforced component assembly |
| Bonding capability | Component bonding | - | Cured adhesive |
