DYMAX 9422-T-SC
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Visual See-Cure Confirmation
- Thixotropic Edge-Dispense Control
- Targeted Component Shock Absorption
Product Description
Dymax 9422-T-SC See-Cure Light-Cure Reinforcement Adhesive is a one-part, thixotropic reinforcement adhesive for fine-pitch and leadless components on printed circuit boards. The material cures with UV or visible light and uses See-Cure color change, shifting from blue to clear as cure develops. Its controlled-flow gel is suited to localized placement around component edges, helping the adhesive remain where reinforcement is needed before exposure. After cure, the material provides targeted component support and shock absorption without functioning as a full-area underfill.
Key features
- Blue-to-Clear Cure Indication: See-Cure color change provides a visible cue as light cure develops.
- Thixotropic Edge Placement: Controlled flow supports localized dispensing around component edges.
- Targeted Shock Absorption: The cured adhesive reinforces fine-pitch and leadless PCB components.
Applications / Suitable for
- Fine-pitch component reinforcement
- Leadless component reinforcement
- Localized shock absorption
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Chemical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
As-supplied characteristics used for material and process evaluation. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component count | One-part | - | As supplied |
| Uncured appearance | Blue gel | - | As supplied |
| Rheology | Thixotropic | - | Controlled edge placement |
| Cure mechanism | UV/visible light | - | After placement |
| Cure indicator | See-Cure blue-to-clear response | - | During cure |
After-processing / final-state properties
Final-state characteristics after the stated cure or processing condition. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cured appearance | Clear | - | After sufficient light cure |
| Cure indication | Blue-to-clear transition | - | During cure |
| Reinforcement behavior | Localized edge support | - | Fine-pitch and leadless components |
| Impact response | Shock absorption | - | Reinforced PCB assembly |
