ECCOBOND FP0066
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Conductive Semiconductor Encapsulation
- Two-Hour Cure at 60 deg C
- Firm Shore D 80 Cure
Product Description
LOCTITE ECCOBOND FP0066 is a single-component, gray, heat-cure conductive epoxy encapsulant for semiconductor applications. The liquid formulation combines electrical conductivity with a hard cured profile for protecting and fixing semiconductor features where a conductive encapsulation material is required. An alternate cure of 2 hours at 60 deg C supports controlled thermal processing, while storage at -40 deg C provides a 30-day shelf-life basis for material planning. The cured epoxy reaches Shore D 80 and a typical bulk volume resistivity of 0.02 ohm cm; the values apply to the stated cure and test conditions.
Key features
- Conductive Epoxy Encapsulation: A typical bulk volume resistivity of 0.02 ohm cm supports conductive semiconductor encapsulation after cure.
- Controlled Heat Cure: An alternate 2-hour cure at 60 deg C provides a defined thermal-processing option.
- Hard Cured Profile: Typical Shore D 80 hardness provides a firm final encapsulant state.
Applications / Suitable for
- Semiconductor encapsulation
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
As-supplied and processing characteristics used for material and process evaluation. Numerical values are typical unless otherwise identified.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | - | As supplied |
| Appearance | Gray liquid | - | As supplied |
| Cure mechanism | Heat cure | - | Processing classification |
| Shelf life | 30 | days | Stored at -40 deg C |
| Alternate cure schedule | 2 | hours | At 60 deg C |
