Name: LOCTITE ECCOBOND UF 9000AE
Brand: Henkel Belgium NV
SKU: ECCOBOND UF9000AE

Main features

Low die warpage
Best large die underfill
260°C reflow capability for Pb- free, low-k applications

Product Description

LOCTITE® ECCOBOND UF 9000AE is a cutting-edge semiconductor capillary underfill designed specifically to meet the demands of next-generation flip-chip BGA (FCBGA) and high-density fan-out (HD-FO)/2.5D integrated advanced packaging designs. These technologies, critical for AI and high-performance computing (HPC) applications, feature large, high-density I/O die within expansive package dimensions, making warpage prevention and die protection crucial for long-term reliability.

LOCTITE® ECCOBOND UF 9000AE excels in this environment by offering robust protection against die warpage and cracking, which are common concerns due to the fine-pitch interconnects found on large die. This PFAS-free epoxy encapsulant boasts a fast flow rate, ensuring that it can fill gaps efficiently while maintaining the integrity of the delicate interconnects. Its high fracture toughness further enhances durability, ensuring that the die remains protected under various operational stresses.

Once fully cured, LOCTITE® ECCOBOND UF 9000AE forms a rigid, self-filleting protective seal that significantly improves the reliability of solder joints. This protective layer not only extends the electrical, thermal, and moisture resistance of the package but also helps to dissipate stress, thereby enhancing overall performance and longevity. The underfill’s low thermal expansion, fast capillary flow, and extended work-life make it an ideal solution for complex, high-density semiconductor packages, ensuring both comprehensive interconnect protection and high processability. It is the best underfill for large die sizes and flip chips applications with small gaps.

Applications

Flip-Chip Ball Grid Array (BGA), Cu Pillar Package, and other high-density interconnect designs

Cure schedule

15 minute ramp to 100°C; 90 minute hold @ 100°C + 15 minute ramp from 100°C to 165°C; 2 hour hold @ 165°C

Packaging

Please select Package Type.

TDS, SDS & Technical Documents

Technical Specifications

General Properties

Pot Life

24 hours

Specific Gravity

1.71

Thermal Properties

Glass Transition Temperature (Tg)

111 °C

Physical Properties

Thixotropic index

0,085

Viscosity

9,082 mPa.s

Additional Information

Semiconductor capillary underfill

LOCTITE ECCOBOND UF 9000AE

LOCTITE ECCOBOND UF 9000AE is a black, heat-cure epoxy capillary underfill developed for large-die flip-chip BGA, Cu pillar, HD-FO and 2.5D advanced packaging. Its low CTE, fast capillary flow, low resin bleed out and self-filleting cured form are designed to support fine-pitch interconnect encapsulation, warpage control and package reliability in high-density AI and HPC package architectures.

Fast capillary flowLow CTELow resin bleed outSelf-filleting curePFAS-free24 hr pot life at 25 deg C

As supplied

Key liquid properties

These values describe the uncured product at the stated conditions. Capillary-flow behavior during dispensing should be evaluated with the intended package geometry and heated process conditions.

Property	Typical value	Condition / context
Technology	Epoxy	TDS product description
Appearance	Black liquid	As supplied
Viscosity	9,082 mPa s (cP)	Brookfield CP 51, 25 deg C, 5 rpm
Thixotropic index	0.85	0.5/5 rpm
Specific gravity	1.71	25 deg C
Pot life	24 hr	25 deg C
Average particle size	1 um	As supplied
Maximum particle size	5 um	As supplied
Shelf life	180 days	Stored at -40 deg C

Processing

Capillary underfill process guidance

Henkel recommends conditioning the material to room temperature before use, preheating the substrate for even under-die flow, controlling the dispense pattern and delay between passes, and completing the documented stepped heat cure. The recommended profile is a guideline and may require adjustment for the customer's equipment, oven loading and application.

1. Thaw and prepare

Allow the container to reach 25 deg C before opening. Keep syringes vertical while thawing, remove external moisture before opening, and place thawed material on dispense equipment for use.

2. Preheat the substrate

Preheat the substrate before dispensing. The recommended substrate temperature is typically 90 to 100 deg C. Henkel recommends checking actual temperature near the dispense area with a thermocouple.

3. Dispense the underfill

A 60 to 80% line, using 1 to 3 passes centered along the die side, is generally recommended. Final volume and pattern depend on die size, gap height, bump density and target fillet height.

4. Control passes and needle

Use minimal delay between passes, typically 0 to 20 seconds, to reduce overflow onto the die. Recommended needle size is typically 22 to 25 gauge.

5. Complete the heat cure

Ramp 15 min to 100 deg C; hold 90 min at 100 deg C; ramp 15 min from 100 deg C to 165 deg C; hold 2 hr at 165 deg C.

Storage and handling

Frozen storage and thawing controls

Store the unopened product in a dry location at an optimal storage temperature of -40 deg C. Storage above -15 deg C can adversely affect product properties. Once thawed to 25 deg C, do not re-freeze the material.

Package format	Recommended thaw time
10 cc syringe	1 hr
30 cc syringe	1.5 hr
55 cc syringe	2 to 3 hr
6 oz cartridge	4 to 5 hr

Handling note: Do not open the container until the contents reach 25 deg C. Remove any moisture collected on the outside of the thawed container before opening, and do not return dispensed or potentially contaminated material to the original container.

Cured material

Thermomechanical properties

The cured property data below are typical reference values from the February 2024 TDS. Tg is reported by both DMA and TMA and should remain tied to the stated test method.

Property	Typical value	Method / region
Coefficient of thermal expansion	23 ppm/deg C	Below Tg
Coefficient of thermal expansion	85 ppm/deg C	Above Tg
Glass transition temperature	111 deg C	DMA
Glass transition temperature	112 deg C	TMA
Storage modulus	13,500 N/mm^2	DMA at 25 deg C
Storage modulus	136 N/mm^2	DMA at 250 deg C

Performance evidence

Large-die flow and reliability evidence

Henkel positions UF 9000AE for highly integrated packages where complete interconnect coverage, low warpage propensity and crack resistance are important. The supplier attributes these characteristics to fast capillary flow, low CTE, low shrinkage and high fracture toughness.

Evaluation	Conditions / scope	Supplier-reported result
Capillary-flow comparison	40 mm x 40 mm die; internal testing versus previous-generation capillary underfills	20% faster flow reported; result is die-size dependent.
Large-die validation	Die sizes up to 50 mm x 50 mm	Henkel reports product performance validated at this die size.
Large-package validation	Package bodies up to 110 mm x 110 mm	Henkel reports demonstrated effectiveness at this package size.
Fine-pitch encapsulation	100 um I/O pitch and low gap heights >45 um	Low/no-voiding bump encapsulation reported in the product info sheet.
Reliability evaluation	MSL3a + 2,000 TCT-B cycles; 192 hr uHAST; 1,000 hr HTS at 150 deg C	Henkel reports good reliability across the listed evaluations.

The comparative 20% flow result is explicitly die-size dependent. Reliability and package-level results should be evaluated against the intended package geometry, process conditions and customer qualification requirements.

Applications

Advanced-package application fit

The product is intended for semiconductor underfill and electronic encapsulation, with documented use contexts centered on large-die, high-density interconnect packages.

Flip-chip BGA

UF 9000AE is designed for large-die flip-chip BGA applications requiring low thermal expansion, fast capillary flow and long worklife. Henkel also reports 260 deg C reflow capability for Pb-free, low-k applications.

Cu pillar packages

Cu pillar is listed as a typical application in the TDS. The material is positioned for fine-pitch, low-gap interconnect encapsulation where capillary coverage and narrow fillet formation are important.

HD-FO and 2.5D advanced packaging

Henkel specifically positions UF 9000AE for high-density fan-out and 2.5D package designs used in AI and HPC. The press release discusses large, thin die and large package-body architectures with dense fine-pitch interconnects.

Product resource

LOCTITE ECCOBOND UF 9000AE product brochure

This product brochure summarizes LOCTITE ECCOBOND UF 9000AE positioning for large-body AI and HPC packages, including key process data, capillary-flow performance, reliability evaluations and supported advanced-package applications.

Product brochure and application overview

Review product-level information covering large-die underfill positioning, processing characteristics, flow performance, reliability data and application fit for flip-chip BGA, Cu pillar, HD-FO and 2.5D semiconductor packages.

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Krayden technical support

Evaluate UF 9000AE for your package design

Krayden can help review package size, die dimensions, interconnect pitch and gap, substrate preheat, dispense pattern, cure requirements and qualification needs when evaluating LOCTITE ECCOBOND UF 9000AE for FCBGA, Cu pillar, HD-FO or 2.5D advanced packaging.