EPMAR SA1803
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Low-Viscosity Potting Resin
- Matched Two-Part Encapsulation
- Electronic Module Potting
Product Description
EPMAR SA1803 Resin Component is the black Part A resin supplied for the EPMAR SS1803 two-component electronic-grade epoxy potting compound. It is combined with SB1803 Hardener to create a low-viscosity system for encapsulating electronic modules. The component is not a complete potting material on its own; cure, mixed-material handling, and final electrical and mechanical properties belong to the matched SS1803 resin-and-hardener system. SA1803 is therefore selected as the resin side of a controlled two-part encapsulation process rather than as a standalone cured product.
Key features
- Part A Potting Resin: SA1803 is the resin component of the matched EPMAR SS1803 system.
- Low-Viscosity Black System: The resin and SB1803 hardener form a low-viscosity black epoxy potting compound.
- Electronic Module Encapsulation: The complete SS1803 system is used to encapsulate electronic modules.
Applications / Suitable for
- Resin component for EPMAR SS1803 electronic-module potting
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Representative uncured properties of the resin, hardener, and mixed epoxy system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Specific Gravity | 1.12 | - | Mixed system |
| Viscosity | 1,900 | cps | Mixed system at 25°C |
| Mix Ratio | 100:42 | parts by weight | Resin : Hardener |
| Pot Life | 30-40 | minutes | 25°C |
| Cure Schedule | 3 hr @ 60°C or 24 hr RT | - | Recommended cure conditions |
After-processing / final-state properties
Representative cured properties of the SS1803 epoxy system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 85 | Shore D | Cured epoxy |
| Heat Deflection Temperature | 72 | °C | Reported value |
| Tensile Strength | 8,500 | psi | Cured epoxy |
| Flexural Strength | 16,200 | psi | Cured epoxy |
| Dielectric Strength | 542 | V/mil | 25°C |
