EPOXYLITE E8112
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Bench and Vacuum Casting
- Long Casting Work Window
- Flexible Elevated-Temperature Cure
Product Description
EPOXYLITE E8112 Hi Temp Epoxy Potting Compound is a two-component heat-cured potting compound supplied as a viscous liquid resin and powder hardener. It is used for bench casting, vacuum casting, and the potting or sealing of electrical and electronic components requiring high-temperature resistance. The system mixes at 100:50 by weight, with resin conditioning at 65 to 85 deg C to reduce viscosity and support bubble release. The mixed compound has an 8 to 12 hour pot life at room temperature and supports several elevated-temperature cure schedules.
Key features
- Bench and vacuum casting: The compound is documented for both conventional bench casting and vacuum casting.
- Eight-to-twelve-hour pot life: The mixed system provides an extended room-temperature application window.
- Multiple heat-cure options: Four cure schedules allow time and temperature to be selected for the assembly process.
Applications
- Bench casting
- Vacuum casting
- Potting and sealing high-temperature electrical and electronic components
TDS, SDS & Technical Documents
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
Component, mixing, conditioning, and pot-life data before cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Resin form | Viscous liquid | - | As supplied |
| Hardener form | Powder | - | As supplied |
| Mix ratio by weight | 100:50 | - | Resin:hardener |
| Recommended resin conditioning | 65 to 85 | deg C | Before adding the powder hardener |
| Pot life | 8 to 12 | h | Mixed system at room temperature |
After-processing / final-state properties
Cure options and bounded high-temperature performance statements.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure options | 16 h at 93 deg C; 4 h at 121 deg C; 1 h at 177 deg C; or 30 min at 204 deg C | - | Heat-cure schedules captured for the exact product |
| High-temperature property range | At least 260 | deg C | Electrical and physical properties |
| Short-duration temperature exposure | > 316 | deg C | Short-period exposure |
