EPOXYLITE E813-9
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Premeasured 100:40 Mixing
- Vacuum-Assisted Electrical Potting
- High-Strength Cured Potting
Product Description
EPOXYLITE E813-9 Hi Temp Epoxy Potting Compound is a two-component heat-cured potting system with a viscous liquid resin and finely divided powder hardener supplied in premeasured kits. It is used for bench casting, vacuum casting, and potting or sealing electrical and electronic components requiring high-temperature resistance. The components mix at 100:40 by weight, and the mixed material has an 8 to 12 hour pot life at room temperature. Typical cured properties include Shore D 95 hardness, 42,000 psi compressive strength, and dielectric strength above 600 V/mil at a 125 mil specimen thickness.
Key features
- Premeasured 100:40 mixing: The resin and powder hardener are supplied for a controlled 100:40 ratio by weight.
- Bench and vacuum casting: The system supports both standard casting and vacuum-assisted processing.
- High-strength cured potting: Typical cured compressive strength is 42,000 psi at 25 deg C.
Applications
- Bench casting
- Vacuum casting
- Potting and sealing high-temperature electrical and electronic components
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical component, mixing, pot-life, and storage data before cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Resin viscosity | 30,000 to 60,000 | cP | At 25 deg C |
| Hardener form | Powder | - | As supplied |
| Weight per gallon | Resin 11.4 to 11.8; hardener 16.6 to 17.0 | lb/gal | At 25 deg C |
| Mix ratio by weight | 100:40 | - | Resin:hardener |
| Pot life | 8 to 12 | h | Mixed system at room temperature |
| Volatile organic content | 0.2 | lb/gal | ASTM D6053; mixed thin film cured under the stated laboratory condition |
| Shelf life | 6 | months | Below 25 deg C in original sealed containers |
After-processing / final-state properties
Typical cured properties retain the stated cure, method, and test-temperature context.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure options | 16 h at 93 deg C; 4 h at 121 deg C; 1 h at 177 deg C; or 30 min at 204 deg C | - | Heat-cure schedules |
| Optional post-cure | 1 h at 204 deg C | - | For highest possible heat resistance |
| Hardness | 95 | Shore D | ASTM D2240 at 25 deg C |
| Glass transition temperature | 200 | deg C | ASTM E831 |
| Linear shrinkage | < 1 | % | ASTM D2566, 100 deg C cure |
| Thermal conductivity | 0.3 | W/(m*K) | ASTM C518 |
| Compressive strength | 42,000 | psi | ASTM D695 at 25 deg C |
| Water absorption | < 0.3 | % | ASTM D570, 2 h at 100 deg C |
| Dielectric strength | > 600 | V/mil | ASTM D149 at 25 deg C, 125 mil specimen |
| Volume resistivity | > 10^12 | ohm cm | ASTM D257 at 180 deg C |
