KALEX 45137
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Controlled 100:5.5 Weight Mixing
- 60-Minute Room-Temperature Gel Window
- Selected Fuel and Alcohol Resistance
Product Description
EPOCAP 45137/55137 Epoxy Encapsulation System is a two-component, filled epoxy potting material that cures at room temperature for low- to medium-voltage electrical components. The 100:5.5 weight mix ratio produces a red mixed compound with a 60-minute gel time at 25 deg C for a 100 g mass. Vacuum de-airing before and after casting is recommended when the work life permits. After cure, the system provides Shore D 80 hardness, 1.2 W/(m K) thermal conductivity, and high electrical resistivity. Applications include potting and encapsulation of electrical components requiring rigid insulation and resistance to selected fuels and alcohol/fuel mixtures.
Key features
- Controlled 100:5.5 Mixing: The weight-based mix ratio supports accurate proportioning of the filled resin and hardener.
- 60-Minute Gel Window: A 100 g mixed mass gels in 60 minutes at 25 deg C.
- Rigid Electrical Encapsulation: Cured material combines Shore D 80 hardness with high resistivity and dielectric strength.
Applications / Suitable for
- Low- to medium-voltage electrical component potting
- Electrical encapsulation and insulation
- Cast assemblies exposed to selected fuels and alcohol/fuel mixtures
TDS, SDS & Technical Documents
Technical Specifications
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical component, mixed-system, and processing properties before final cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio by weight | 100:5.5 | 45137 resin to 55137 hardener | |
| Mix ratio by volume | 100:9 | 45137 resin to 55137 hardener | |
| Part A viscosity | 12,000 | cps | 45137 resin at 25 deg C |
| Part B viscosity | 40 | cps | 55137 hardener at 25 deg C |
| Mixed specific gravity | 1.58 | At 25 deg C | |
| Gel time | 60 | minutes | 100 g mass at 25 deg C |
| Shelf life | 12 | months | Each component in a separate sealed container |
| Storage temperature | 16 to 27 | deg C | Dry environment |
After-processing / final-state properties
Typical cured properties after the stated room-temperature or accelerated cure schedule.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 80 | Shore D | Cured material; tested at 25 deg C |
| Tensile strength | 7,968 | psi | Cured material; tested at 25 deg C |
| Compressive strength | 12,030 | psi | Cured material; tested at 25 deg C |
| Flexural strength | 15,280 | psi | Cured material; tested at 25 deg C |
| Elongation | 0.84 | % | Cured material; tested at 25 deg C |
| Thermal conductivity | 1.2 | W/(m K) | Cured material |
| Volume resistivity | 1.06 x 10^15 | ohm cm | Cured material at 25 deg C |
| Dielectric strength | 358 | V/mil | Cured material at 1/8 inch thickness |
